[MEMS-Business] Press Release: Innovative Micro Technology (IMT) Introduces Getter Deposition Services

Mon Apr 9 19:59:45 EDT 2007

Santa Barbara, CA, 10 April 2007 - Innovative Micro Technology today
announced it has begun offering getter deposition services for
wafer-level packaging of MEMS and other devices that require hard vacuum
for device performance.  In exhaustive testing, IMT has demonstrated
vacuum levels equal to or surpassing other established getter deposition
services (see figure).  Using IMT's proprietary getter (patent pending),
IMT has routinely achieved vacuum levels below 10 mTorr in production of
inorganic devices for such applications as IR emission and sensing and
for resonant oscillators in biological and chemical hazard detection
applications.  

IMT's getter deposition services are performed on 150mm or smaller
wafers in IMT's Class 100 cleanroom in Santa Barbara, California with
fast turnaround of 3-4 weeks for patterned wafers.  Faster turnaround is
available on request.  Shadow masking services are also available.
Customers are encouraged to call for price quotations and delivery.  

IMT CEO, John Foster commented, "We see this addition to our MEMS
manufacturing services as fulfilling an industry-wide need for
fast-turnaround, cost-effective deposition of high-quality getters to
enable wafer-level packaging of a wide range of devices that require a
vacuum environment.  Our getter has been proven to be equal to or better
than the industry standard materials available today."

IMT also offers a full suite of MEMS design, prototyping, and production
manufacturing services to fabless and fab-light companies in our 30,000
square foot Class 100 fab, the largest and best-equipped independent
MEMS fab in the world.  Services include: 
Basic device design and design for manufacturability 
* Extensive high-volume manufacturing experience, including SQC/SPC 
* 6" wafer efficiency 
* 30,000 sq. ft. Class 100, fully automated clean room/fab with superior
tool set for all aspects of wafer processing 
* Sub-micron photolithography to 0.35um 
* Wafer-level bonding (glass frit, eutectics, anodic, fusion, polymer)
for device encapsulation (vacuum, atmospheric and partial pressures) and
microfluidic construction * Getter deposition for vacuum wafer-level
packaging (firing temperature 400C) 
* Deep reactive ion etching (DRIE) 
* Electroplating of Au, Cu, Ni, In, NiFe, and other alloys
* Chemical-mechanical polishing (CMP) 
* Extensive non-CMOS materials flexibility in deposition, etch,
magnetics, polymers, etc. 
* Unmatched metrology tools and experience    

About Innovative Micro Technology
IMT was formed in 2000, specifically to produce MEMS
(micro-electromechanical systems) devices. IMT's overriding goal is to
partner with companies to develop products based on MEMS technology.
Its 130,000 sq ft facility contains a 30,000 sq ft clean room/fab, the
largest and best-equipped independent MEMS fab in the world.  The
company was built for high-volume manufacturing, and provides full
foundry services from design through production.  IMT currently has >150
employees and >20 customers in diverse applications, including drug
discovery, drug delivery, biomedical implants and cell purifiers,
microfluidics, inertial navigation, printing, various sensors, night
vision, IR emitters, telephone/DSL switching, RF devices, power
management, and several others.  Contact Monteith Heaton:  phone (805)
681-2852; fax (805) 967-2677, email monte at imtmems.com, or visit
www.imtmems.com.

# # #