[mems-talk] need the fabrications of RF MEMS

[=?gb2312?q?=CD=F5=E7=E2=B1=F9?=]

Hi,
Maybe we can do some works on the fabrication of RF
MEMS for you.We have some applications bsaed on
cantilever beam. if you can describe the cantilever
beam structure in detail, and i will estimate the
prices, time etc.

Wang

 --- Sukanta <sukant_2 at rediffmail.com> µÄÕýÎÄ£º> Hi
>   I need to fabricate RF MEMS based on cantilever
> beam 
> structure.Can anybody do it if I provide the designs
> of my own.If 
> so,please let me know the prices(charge in $),time
> etc....
> 
> sukanta
> 
> On Fri, 08 Aug 2003 mems-talk-request at memsnet.org
> wrote :
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> >
> >Today's Topics:
> >
> >    1. 	InfraRed Inspection/Automated Inspection
> opportunities 
> >in
> >       MEMSWafer	Bonding (Tom Molamphy)
> >    2. Market Size for different Wafer Bonding
> Methods? (Tom 
> >Molamphy)
> >    3. RE: Re: Diffusion or Ion implantation (Karl
> Cazzini)
> >    4. RE: Market Size for different Wafer Bonding
> Methods?
> >       (Maurice Norcott)
> >    5. RE: Glass-Glass bonding (Brubaker Chad)
> >    6. Tanks for KOH etching (Mark West)
> >    7. need thin film SOI wafers (Marcus Siegert)
> >    8. RE: Tanks for KOH etching
> (beaton at npphotonics (Bill 
> >Eaton))
> >    9. RE: Re: Diffusion or Ion implantation (Chris
> Kovach)
> >
> >
>
>----------------------------------------------------------------------
> >
> >Message: 1
> >Date: Thu, 7 Aug 2003 09:43:16 -0600
> > From: "Tom Molamphy" <tom_molamphy at phoseon.com>
> >Subject: [mems-talk] 	InfraRed Inspection/Automated
> Inspection
> > 	opportunities in MEMSWafer	Bonding
> >To: <mems-talk at memsnet.org>
> >Message-ID:
> <001501c35cfa$9f172760$e5aefea9 at CPQ28582865189>
> >Content-Type: text/plain;	charset="us-ascii"
> >
> >Hi,
> >
> >I wanted to get some feedback on potential infrared
> 
> >inspection/automated
> >optical inspection applications in Wafer Bonding
> and bond issues 
> >for
> >finished wafers. We currently have an automated
> infra red system 
> >for
> >inspection of seal quality/position for glass frit
> bonded MEMS 
> >wafers where
> >we inspect the whole wafer at the die level prior
> to dicing. The 
> >key here is
> >making sure the glass frit has bonded appropriately
> (to ensure 
> >hermeticity)
> >and has not "moved" too close to the device itself
> using optical 
> >inspection.
> >
> >
> >
> >
> >Are there similar needs with anodic, direct or
> polymer type 
> >bonding - in
> >other words is there a need for any automated
> inspection of the 
> >bond
> >interface at the device level?
> >
> >
> >
> >What about general wafer level bonding inspection
> needs for SOI 
> >wafers etc.?
> >
> >
> >
> >
> >Any opinions welcome!
> >
> >
> >
> >________________________________________________
> >
> >Tom Molamphy
> >
> >Phoseon Technology
> >
> >Office: 970 266 8097
> >
> >Cell: 970 443 1864
> >
> >Fax: 970 267 0801
> >
> >www.phoseon.com
> >
> >
> >
> >
> >
> >
> >
> >
> >------------------------------
> >
> >Message: 2
> >Date: Thu, 7 Aug 2003 09:45:41 -0600
> > From: "Tom Molamphy" <tom_molamphy at phoseon.com>
> >Subject: [mems-talk] Market Size for different
> Wafer Bonding 
> >Methods?
> >To: <mems-talk at memsnet.org>
> >Message-ID:
> <001a01c35cfa$f54ba2a0$e5aefea9 at CPQ28582865189>
> >Content-Type: text/plain;	charset="us-ascii"
> >
> >Hi All,
> >
> >Any idea on where I might find market data for use
> of different 
> >wafer
> >bonding methods for MEMS? Any opinions on likely
> winners in this 
> >technology
> >moving forward?
> >
> >Thanks,
> >
> >Tom
> >
> >________________________________________________
> >
> >Tom Molamphy
> >
> >Phoseon Technology
> >
> >Office: 970 266 8097
> >
> >Cell: 970 443 1864
> >
> >Fax: 970 267 0801
> >
> >www.phoseon.com
> >
> >
> >
> >
> >
> >
> >
> >
> >------------------------------
> >
> >Message: 3
> >Date: Thu, 7 Aug 2003 12:17:04 -0400
> > From: "Karl Cazzini" <karlcazzini at rcn.com>
> >Subject: RE: [mems-talk] Re: Diffusion or Ion
> implantation
> >To: <anupama at ee.washington.edu>,	"General MEMS
> discussion"
> > 	<mems-talk at memsnet.org>
> >Message-ID:
> <MKEPJIEBAMHOFEIJGLPLOEEDCBAA.karlcazzini at rcn.com>
> >Content-Type: text/plain;	charset="iso-8859-1"
> >
> >probably the best people for this are implant
> Sciences 
=== message truncated === 

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