[mems-talk] DSP vs SSP
Kirt & Erika Zipf-Williams
zipf-williams at mindspring.com
Thu Jul 3 12:03:37 EDT 2003
> Wafers have two polishing options: Double Side Polished or Single Side
> Polished. I am wondering whats the particular applications for these two
types
> of wafers? Why are they differentiated?
> Anybody could enlighten me?
If you need to do lithography or wafer bonding on the back side of the wafer
(as is required for many MEM devices),
DSP is needed.
--Kirt Williams, Ph.D. consultant
More information about the MEMS-talk
mailing list