[mems-talk] Gold plating -- bonding issue

[deepa sree]

Hello

I am trying to plate gold on GaAs using neutronex 309 at 35C and 0.4ASD. I am maintaining the bath at the company recommended pH, specific gravity and conducting salt concentration. Bonders are having to use very high bond pull force to bond to the surface. Can anyone suggest me any improvements to make the plating more bondable? Your inputs are appreciated.

Thanks
Deepa