[mems-talk] Wire bond pads *atop* SU-8

Jon Fox fox at researchsupport.com
Wed Nov 29 12:46:05 EST 2006


I have reason to pattern a wire bond pad on the top of some SU-8 but am 
having trouble getting
sufficient adhesion with Ti and Cr to allow for ultrasonic ball bonds of 
sufficient strength.

What are other folks doing to make wire bonds to structures build atop 
an SU-8 layer?

-- Jon

Jon R. Fox
Principal Scientist, Research Support Instruments, Inc. 
Visiting Researcher, Princeton University
fox at researchsupport.com
tel: 732-329-3700 x 103
fax: 732-329-9200



More information about the MEMS-talk mailing list