[mems-talk] PDMS bonding Vol 49, Issue 24

[huy vo]

Laura:
   
  Most of the time people need to coat the wafer with some kind of antiadhesion before casting PDMS because the bond between PDMS to Si is quite strong and therefore you don't always need to modify the PDMS surfaces before bonding. If you are to press the PDMS surface against the Si surface then bake them overnight, you will find that they bonded just fine. To improve the strength of this bond, you might want to clean the PDMS in diluted HCl solution before bonding them. The said procedure is a reversible bond. 
   
  H
   
   
   
  o: General MEMS discussion 
Message-ID: <456DB5F6.4090703 at inti.gov.ar>
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Dear all,

I want to bond my PDMS structure (with microfluidic chamber/ channels) 
over a Si device. My question is how can I do activation without an 
oxygen plasma dedicated equipment.
Can I use a sputtering machine? we have a sputtering with DC/RF source, 
and it has a bias to perform the plasma over the substrate (it is used 
to clean the surface before deposition). If yes, which gas do you 
recommend me to use?