[mems-talk] Gold plating through a via hole

[Gary]

Deepa, You might try ultrasonic agitation during the plating cycle. Gary

Gary Hillman
Service Support Specialties, Inc.
9 Mars Court
PO Box 365
Montville, NJ 07045
973-263-0640
973-263-8888.



-----Original Message-----
From:	deepa sree [SMTP:dapisree at yahoo.co.in]
Sent:	Wednesday, October 04, 2006 7:29 AM
To:	mems-talk at memsnet.org
Subject:	[mems-talk] Gold plating through a via hole

Hello

I am trying to plate gold through a via hole of 100 um in diameter and 
125um deep. I am having problems with gold plating solution getting trapped 
in the hole, though I am plating at a very slow rate. I wanted to know is 
there a way to overcome this or is there any other method to make a through 
hole contact. There is layer of Ti and a layer of sputtered gold in the via 
to which I want to make a contact.