[mems-talk] Partial Metallization of Vertical Walls

Xiaoguang "Leo" Liu liuxiaoguang at gmail.com
Mon Oct 16 11:26:34 EDT 2006


Dear all
Thanks for responding.
I'm sorry I made a mistake in my original email. The cavity I'm
considering is 10mmx10mmx1mm in demension. It is etched in a thick
slab of Silicon wafer. Thanks
Best
Leo

On 10/16/06, Beggans Michael H IHMD <beggansmh at ih.navy.mil> wrote:
> If the walls are next to one another, then you could e-beam deposition metal
> using a shadow mask and a 45 degree angle between them with a 45 degree
> offset of the rectangular hole in the mask to the hole in the substrate. If
> you need them opposite, then you can use a shadow mask with the wafer at 45
> degrees to the mask and the sidwalls aligned to the shadow mask opening;
> then rotate the wafer 180 degrees and deposit again.
>
> They probably won't be very uniform coatings though. Also, make sure that
> all the polymer from the DRIE process is gone.


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