[mems-talk] Photoresist Hard Bake question

Bill Moffat BMoffat at yieldengineering.com
Fri Sep 1 10:45:25 EDT 2006


Absolute answer is Sylilation, possible simple answer is vacuum bake.
Bill Moffat 

-----Original Message-----
From: mems-talk-bounces at memsnet.org
[mailto:mems-talk-bounces at memsnet.org] On Behalf Of Xiaoguang "Leo" Liu
Sent: Thursday, August 31, 2006 3:25 PM
To: General MEMS discussion
Subject: [mems-talk] Photoresist Hard Bake question

Dear all
I'm using AZ926 photoressit for a thickness of 20um. However, after
hardbake (85 degree C for 20minutes), the photoresist reflows and does
not maintain the near vertical profile. I wonder if anybody knows anyway
to prevent the reflow of photoresist during the hardbake process? Thanks
a lot.

Leo

Electrical and Computer Engineering
Purdue University
liu79 at purdue.edu


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