[mems-talk] Cutting chips with fragile free-standing devices into small pieces

[D. Zhou]

Dear all,

I am fabricating some free-standing MEMs devices based on SOI wafer. Now I 
need to cut the chips into individul devices to do some measurements. The 
problem is that the structure is so fragile that when cutting it using 
scriber and breaking it with hands the whole structure collapses. Could 
anyone who has been faced with the same problem please give me any 
suggestions? Thanks very much.


-- 
Xiang Zhou
PhD candidate
Semiconductor Physics Group
Cavendish Laboratory
University of Cambridge