[mems-talk] Cutting chips with fragile free-standing devices into small pieces

[Torsten Wagner]

Hi,

never faced this problem just got a idea during reading your text.
Dependent on your kind of structure, you might try to packaging the 
whole structure with a photoresist or something like this.

Then you can handle your structure, store them easily etc. and just if 
you need them dissolve the protecting layer.

However, its hardly depends on the other materials on your chip and on 
the geometry.

Just a two cents idea ;)

Bye
Torsten


D. Zhou wrote:
> Dear all,
> 
> I am fabricating some free-standing MEMs devices based on SOI wafer. Now 
> I need to cut the chips into individul devices to do some measurements. 
> The problem is that the structure is so fragile that when cutting it 
> using scriber and breaking it with hands the whole structure collapses. 
> Could anyone who has been faced with the same problem please give me any 
> suggestions?