[mems-talk] DRIE etching

[Nicolas Duarte]

This is what DRIE does.  If you are using the Bosch process there is 
no way to completely get rid of the scallops, but you can reduce them 
by optimizing your process.  Higher substrate power and shorter 
cycles should help out.

If you want to completely get rid of scallops I am told that the Cryo 
process is a DRIE process that has no scallops (since there is no 
cycling in that) but you need a special tool to do it (most DRIE 
machines cannot switch between the two processes).

Nik

At 12:25 AM -0700 9/9/06, Shankar Dutta wrote:
>we are trying to do a DRIE etching (~15-20 micron deep) for comb 
>like structure. the masking layer is 0.3micron oxide layer. we 
>patterned the oxide layer by BOE etchant. after that we performed 
>the DRIE experiment. but surprisingly we find some scalopes in 
>etched area, as if it does some isotropic etching. is this problem 
>related to paterning of oxide layer with BOE.