[mems-talk] Ni residue (?) when sputtered Ni was removed by Transene Ni etchant TFB or Type I

[EUNKI HONG]

Hi All,

I am trying to etch 50nm Au/10nm Cr/1 um SiO2 using sputtered Ni as a masking layer.
After ICP etching, I removed the remaining Ni using Transene Ni etchant TFB (or Type I).
I found a thin layer on top of Au which is an insulating layer after the Ni was removed. 
Does someone know what this layer is and how to remove this layer? Thank you.


Eunki