[mems-talk] Metallization Peel on Anodic Bonded Glass Wafer

John Dangtran jdangtran at s3cinc.com
Tue Apr 10 15:32:10 EDT 2007


Dear all, 

Could anyone shed us a light to the problem?  I use Ti-Pt-Au on glass, which
is anodically bonded to silicon substrate with bad results, the metal
adhesion failed.  In the past, we had good results on the 4" wafers until we
switched to the 6".  We sputter- etched 500A of glass before depositing
Ti-Pt-Au.

Thank you, 

John


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