[mems-talk] Adhesion Layer for Ag and Al

[Jesse D Fowler]

Hi Xinhua,
Those are your two best options. Cr is higher stress, but resists acids 
(like HF) better. Ti is lower stress, but is eaten away quite quickly by 
acids like piranha and HF.
It depends on what other processes you're doing with the substrate.

Jesse Fowler



"Xinhua Zang" <xinhua.zang at gmail.com> writes:

Subject [mems-talk] Adhesion Layer for Ag and Al

Hi All,

Recently I evaporated Al and Ag onto a silicon substrate with thermal 
oxide.
I did not use any adhesion layer. Al layer seems to be ok, but Ag layer is
peeling off. Could some body suggest an adhesion layer for Ag like Cr or 
Ti.