[mems-talk] Lift-off Process for High Density Metal Electrodes(5-10 microns separation)

[Bill Moffat]

Image reversal using a YES ammonia reversal unit has been the standard
for mask makers for the last 20 years.  Contact me for free tests and
technical papers discussing mask making with a 3 Sigma 0.08 micron
control.  Bill Moffat  

-----Original Message-----
From: mems-talk-bounces at memsnet.org
[mailto:mems-talk-bounces at memsnet.org] On Behalf Of AKM Newaz
Sent: Wednesday, August 22, 2007 8:44 AM
To: mems-talk at memsnet.org
Subject: [mems-talk] Lift-off Process for High Density Metal
Electrodes(5-10 microns separation)

Dear All,

           I am designing a photomask for a high density metal
electrodes.
They electrodes are 2 microns of width, 5 mm long  and separated by 5~10
microns. I am planning for 200 nm of Ti/Au metal. The first question
will be should I use image reversal (AZ5214 using bright field mask) or
bi-layer photoresis (LOR+S1813 using dark field mask)? OR should I use
completely different photoresist? I found in the mems-talk archive that
bi-layer photoresist has some problem for high density electrodes. Any
suggestion will be highly appreciated. Thanks in advance.

Newaz