[mems-talk] information about silicon flatness

[Andrea Mazzolari]

Hi all,
I need silicon wafers with the following specs:
 
orientation: (110)+/- the best possible value
flat: (111))+/- the best possible value
Surfaces: DSP
TTV: the lowest possible value
Bow: the lowest possible value
Warp: the lowest possible value
Thickness: i can accept any thickness, (i can accept also 1cm or more thick
material) I'm interested only to low TTV, warp, bow. I need a flatness of
500 or less over an area of 30mm x 10mm.
 
Do you know someone able to provide such material ? Eventually, i can buy
thick silicon wafers from commercial sources, and then find a company able
to reprocess them. I presume that ideal whould have the job made by a
company specialized in optics realizations.
 
I also have some technical questions: which is the relation between warp,
ttv, bow and flatness of a wafer ? 
For my understanding, TTV is not related to flatness of wafer: you can have
any TTV, but very planar surfaces of silicon wafer.
For my understanding, a low warp and bow values translates in high flatness,
is this correct ?

Many thanks,
Andrea