[mems-talk] anodic bonding of glass and si

Roger Shile rshile at nanoink.net
Wed Feb 7 12:09:52 EST 2007


Usually one applies a point ANODE (- terminal of the power supply) to the
Pyrex to avoid trapping air.  However you should still be able to bond
successfully if a point contact is made to the Si with the + terminal.
Bonding won't occur unless the polarity is correct.

Roger Shile

-----Original Message-----
From: mems-talk-bounces at memsnet.org [mailto:mems-talk-bounces at memsnet.org]
On Behalf Of Daniela Kögler
Sent: Wednesday, February 07, 2007 2:01 AM
To: mems-talk at memsnet.org
Subject: [mems-talk] anodic bonding of glass and si

Hi,

I tried to bond a glass (pyrex) and si wafer with 1000 V, 430°C and 30
minutes (point cathode), both wafer cleaned with acetone. Unfortunately it
did not work. There was only a vacuum between the wafers and it was 
possible to separate them after the bonding.


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