[mems-talk] anodic bonding of glass and si

Edward Castellana castellana at mail.chem.tamu.edu
Wed Feb 7 12:27:34 EST 2007


Try an R.C.A. clean first (skip the HF etching step for 
the Pyrex).

Ed
  
>I tried to bond a glass (Pyrex) and si wafer with 1000 
>V, 430°C and 30 minutes (point cathode), both wafer cleaned with 
>acetone.  Unfortunately it did not work. There was only a vacuum 
>between the wafers and it was possible to separate them after the 
>bonding.
 


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