[mems-talk] Shipley S1818 shrink/melt during hard bake

[junyu at berkeley.edu]

Hi, I'm a graduate student at UC Berkeley. I used S1818 for high density
2um feature photolithography on Si wafer. The pattern looks great after
development with MicroDev. However, after hard bake in a 125oC oven for 30
min, the fine features turned into an area of mud/spagattii kind of mass.
Larger features, 100um lines, were still fine.

Does this mean my S1818 is bad? Or is this an intrinsic problem of S1818?
Should I reduce the hardbake temperautre and time?

Thank you!

Junyu Mai