[mems-talk] Au-Au bonding

[Xiaoguang Liu]

Dear Heyshan

That sounds like a simple process. I wonder how much bonding area you had on
the sample. I guess the pressure is really important. Thanks

Best
Leo

On 6/17/07, Mendis, Heyshan <Heyshan.Mendis at dsto.defence.gov.au> wrote:
> We bonded some samples around 250-300C on our flip chip machine with
> around 5-10N force for 2-5min. Make sure both surfaces are oxide free.
> You also could enhance the strength by heat threatment around 300C for
> 0.5-1hrs.