[mems-talk] Wafer-level bonding using SU-8

Chih-Chieh Cheng chih-chieh.cheng at asu.edu
Wed Jun 20 15:23:14 EDT 2007

Previous message: [mems-talk] Re: Selective RIE etching of silicon over silicon oxide
Next message: [mems-talk] spring constant of complex cantilever beams
Messages sorted by: [ date ] [ thread ] [ subject ] [ author ]

Hi, everyone

I am trying to bond two quartz wafers (Fused Silica) using su-8 as the
intermediate layer to package the RF MEMS switches. Does anyone know if the
curing process of SU-8 involves outgasing? Will that seriously harm the
switches?

Thanks

Chih-Chieh

Previous message: [mems-talk] Re: Selective RIE etching of silicon over silicon oxide
Next message: [mems-talk] spring constant of complex cantilever beams
Messages sorted by: [ date ] [ thread ] [ subject ] [ author ]

More information about the MEMS-talk mailing list