[mems-talk] Isotropic silicon etch

[Shao Guocheng]

hi, Dan:
       According to my knowledge, 0.5um lot-to-lot accuracy will be really hard for most of the silicon etching process. But you may try "etch-stop" technology. The process will be more complicated and you may need special treated wafer. Hope this helps.
   
  Guocheng Shao

"Chilcott, Dan W" <Dan.W.Chilcott at delphi.com> wrote:
  To All,

I am looking for a well controlled isotropic silicon etch for etching 2 um deep features. I do not believe that a timed plasma etch would be controlled enough for this application. I am looking for a control of better than 0.5 um from lot to lot and across the wafer. Any ideas?