[mems-talk] Au electroplalting on Ni.

[kris]

Hello Peter,

I usually dip the wafer with the Ni seed layer in dil
H2SO4 (5% in water) for 2 mins.

I would rinse the wafer in Di water and immediately
transfer it into the Au plating bath.

No amount of time is wasted in starting the current.
the wafer should not be died at any time.

thanks,
Kris