[mems-talk] Developer for AZ9260

[Brubaker Chad]

Additional suggestions:

Make sure you are using HMDS adhesion promoter (vapor prime works best).

Make sure your softbake is at least 3 minutes at >105ºC. If possible, you'll also want to do a ramped softbake (ramped proximity, if available) to avoid rapid vaporization of the solvent in the resist.

You'll want to make sure that your exposure dose is at least:
	If broadband, >200 mJ/cm2 as measured at i-line (remember, even through the measurement is at i-line, you are still providing g- and h-line, to which AZ9260 is also sensetive).

If narrow band (i-line, g-line), use at least 600mJ/cm2 as the gentleman below mentions.

You may also ant to provide a delay time between coat-expose and expose-develop to allow time for re-hydration of the film as well.  It could be between 5 and 30 minutes, depending on clean-room humidity (I live in Arizona, and was previously in a non-humidity controlled cleanroom; needless to say, I was on the long end of this time).

When properly soft-baked, AZ9260 is a very high-contrast material (and capable high aspect ratios >5:1 as well), and should not be prone to attack to a 1:4 400K solution. The gentleman below recommends 1:2.5; this will shorten the develop time, but makes the process envelope much smaller, since the higher concentration is much more prone to attack the un-exposed region.

Best Regards,
Chad Brubaker

EV Group       invent * innovate * implement
Senior Process Engineer - Technology - Tel:  480.727.9635, Fax:  480.727.9700  e-mail: c.brubaker at EVGroup.com, www.EVGroup.com

-----Original Message-----

-----Original Message-----
From: mems-talk-bounces at memsnet.org [mailto:mems-talk-bounces at memsnet.org]
On Behalf Of Yue Mun Pun, Jeffrey
Sent: Friday, May 25, 2007 8:15 AM
To: mems-talk at memsnet.org
Subject: [mems-talk] Developer for AZ9260

Hi,
I am trying to pattern gold metal lines (100microns width) via lift-off
using AZ9260 resist.  The gold thickness is about 600nm.  After spiining the
AZ9260 at about 2400rpm for 60s, I discovered that the resist is about
7-8micorns thick, which is sufficiently thick for the lift-off process.
May I know which developer is recommended?  I use AZ400K Developer :DI water
in the ration of 1:4 for 8-9 mins and found that this works but the timing
is very critical because a shorter time results in resist remaining and a
longer time than this causes my patterns to be lifted off in the development
process.