[mems-talk] SiN/SiN bonding and substrate etch

Nicolas Duarte nbd110 at psu.edu
Thu Nov 1 10:35:06 EST 2007


Chemical etchants such as KOH or EDP can remove the Silicon with good  
selectivity.

Nicolas Duarte
Ph.D. Candidate at Penn State University

On Oct 30, 2007, at 12:12 AM, Nor Hafizah Ngajikin wrote:

> Hi,
>
> I have a question on how and what material can be used to bond SiN  
> (wafer 1) with SiN (wafer 2). Secondly, does anybody know what  
> process can be used to totally remove a part of back side Si Wafer  
> without affecting the SiN layer  at the front side.
>
> 

Nicolas Duarte
Ph.D. Candidate at Penn State University





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