[mems-talk] Au peeling away from Cr adhesion layer

[Wilson, Thomas]

As an earlier respondent noted, if one sequentially sputters first Cr (I use
 ~10 nm) and then Au (I use ~100 nm) in-situ, then any subsequent patterning
with AZ5214E and AZ developer inflicts no damage upon the resulting thin
 metallic film. I've thermally cycled such films between room temperature 
and 1.6 K over 50 times with no noted visible or electrical deterioration. 
(as described in J. Low Temp. Phys. 151 (1/2), 201-205 (April) 2008).

Thomas E. Wilson
Professor of Physics
Marshall University
Science 154
One John Marshall Drive
Huntington, WV  25755-2570

Tel: 304.696.2752
FAX: 304.696.3243