AW: [mems-talk] Cantilever sowing

[Miyakawa, Natsuki]

Hi Elina,

If your substrate is single crystal silicon, you can try the so-called "stealth dicing" developped by Hamamatsu photonics. In this method, you produce crystal defects using IR-laser WITHIN the substrate. The chip separation is done by stretching the dicing tape subsequently. This method is free of water, dust, mechanical stress and edge chipping, thus ideal for dicing the chips with fragile structures like cantilevers or membranes. 
For more info, see the link below.

http://jp.hamamatsu.com/products/semicon-fpd/pd393/L9570-01/index_en.html 


Best regards,

Natsuki


-----Ursprüngliche Nachricht-----
Von: mems-talk-bounces at memsnet.org [mailto:mems-talk-bounces at memsnet.org] Im Auftrag von Ir. Elina Iervolino
Gesendet: Sonntag, 10. Februar 2008 13:00
An: mems-talk at memsnet.org
Betreff: [mems-talk] Cantilever sowing

Hello!

I have  wafers with cantilever that need to be sowing to obtain the 
single die. 
I tried with one but all the cantilever do not survive because of the water flushing
on the wafer
Do anyone have experience with the sowing of the wafer with cantilever?