[mems-talk] Critical Dry

[Jack Mulligan]

Rama -

Since water is not miscible in acetone what is most likely happening inside
what I assume is an atmospheric dryer is the acetone vapor is leaving the
surfaces at a much faster rate leaving the water behind on the surfaces to
evaporative dry which leaves watermarks or spots which can cause striation
problems.

We have a solution for this using our proprietary vacuum process. Feel free
to write me for more information. I am careful not to put too much
information in an email that might be seen as using the discussion board for
commercial purposes.

Thanks.

Jack Mulligan
HyperFlo
jmulligan at hyperflo.com


-----Original Message-----
From: mems-talk-bounces at memsnet.org [mailto:mems-talk-bounces at memsnet.org]
On Behalf Of Ramakrishna Kotha
Sent: Thursday, June 26, 2008 12:34 AM
To: mems-talk at memsnet.org
Subject: [mems-talk] Critical Dry

Hi,
 
I am performing critical dry to release a parallel plate structure, which
has SiO2 as a sacrificial layer

After removing the sacrifical layer-SiO2 with BOE, then the device is
transffered to DI Water and then to Acetone in the critical dry chamber.
After performig critical dry process using Polaron-CPD 7501 tool, all the
structures are damaged (due to stiction problem). 

Can anyone, suggest me the accurate process to perform critical dry.
 
Thanks in advance
Rama