[mems-talk] Ni plating on Au film

[Qi Luo]

In our structure, we electroplate Ni on Au substrate. Our process has Alkaline clean, another step of activation, Ni strike, then Ni plating. For our application, the adhesion of the plated Ni to Au film is very important. Can we replace the Ni strike with Au strike, or insert a Au strike before Ni strike to improve adhesion? Your help would be greatly appreciated.
With kind regards,
Qi Luo