[mems-talk] Au electroplating on Cu seed layer

[BastiWicklein at aol.com]

Colleagues,
 
I'd like to  perform Au electroplating. For particular PVD reasons I cannot 
provide  an Au-seed layer.
Since Cu forms an alloy with Au I was wondering weather it is feasible to  
electroplate Au onto Cu.
Since I'm cautious with Gold I was wondering if you could provide me  with 
some input in this matter before I start electroplating.
So far I'm planing to use a sulfite based Au-electrolyte since  CN-based 
electrolytes might not be good with photoresists. The question  mark here is how 
the Cu behaves in such a solution and if it might  dissolve in the Sulfite 
electrolyte etc....or if another solution might be  better....
 
I would appreciate any comments in that matter!
 
Regards,
 
sebastian