[mems-talk] 20um features using AZP4620

[Oakes Garrett]

Michael, 

You might also want to explore the newest offerings from AZ.  I substituted AZ50XT for AZ92xx in a thick film plating process at my former employer.  Certain offerings in the XT series are replacements for the AZ92xx series of resists.

My process flow for this resist was:

33 µm coat AZ 50XT

110 °C soft bake for 4'

EBR

17 µm coat AZ 50XT

110 °C soft bake for 7'

Exposure

Develop in AZ421k


The purpose of the double coat and the intermediate EBR step was to eliminate the edge bead on the wafer without eliminating edge coverage.  The follow on step was thick Cu plating with a pin contact plater.  Copper would deposit in a bad location if my edge protection was removed.


Best of luck,


- Garrett



-----Original Message-----
From: Haixin Zhu [mailto:Haixin.Zhu at asu.edu] 
Sent: Friday, June 13, 2008 1:43 PM
To: General MEMS discussion
Subject: Re: [mems-talk] 20um features using AZP4620

Dear Chad,


U are right. Though I succeeded in making 38um thick pattern with 20um feature size, there is still some problem with undercut of the pattern and bottom residue. I will try AZ 9260, and hoping you can send me your processing traveler so I can use as reference and start point.

Thanks

Michael