[mems-talk] Polymer residual about RIE etching of SiO2 by CHF3

[Kvel Bergtatt]

i didn't state O2 plasma will remove the Teflon. O2 plasma will
_Oxidize_ the polymer, and then a wet clean (basic preferred) will
help removing any dry etch-remaining stuff.

just to clarify.

On 6/20/08, Andrew Sarangan <asarangan at gmail.com> wrote:
> It is unlikely you will be able to entirely remove the flourocarbon
> polymer with O2 plasma. Try etching with CF4 or SF6. That should
> produce less polymer deposition.
>

-- 
_fm