[mems-talk] Electroless Cu plating

[Cassie Iany]

Hello, 
 
I am doing Electroless Cu plating on SiO2 substrate. I found the solution can deposit Cu film on Si but not SiO2. I tried to use different self-assembly monolayer to modify the surface, but still not succeed. One thing I am concerned about the SiO2 substrate cleaned with Pirana solution has contact angle of 45 degree which is different from other reported contact angle (nearly Zero degree). I don't know how the difference comes. 
 
Appreciate if you share your experience and suggestion. 
 
Regards
 
Cassie