June 2008 Archives by date

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Starting: Sun Jun 1 00:54:57 EDT 2008
Ending: Mon Jun 30 12:49:37 EDT 2008
Messages: 114

• [mems-talk] Photoresist to withstand acidic anodization   pradeep # sharma
• [mems-talk] Database for photoresist   pradeep # sharma
• [mems-talk] Damaging of boats during nickel evaporation   Tolga YELBOGA
• [mems-talk] AFM scratch photoresist for nanograting   刘畅
• [mems-talk] AFM scratch photoresist for nanograting   Roger Shile
• [mems-talk] Integrating a thick dielectric layer surrounding suspended silicon nitride membranes   Ken Healy
• [mems-talk] Integrating a thick dielectric layer surroundingsuspended silicon nitride membranes   Roger Shile
• [mems-talk] Integrating a thick dielectric layer surrounding suspended silicon nitride membranes   Paul Sunal
• [mems-talk] Photolithography on Mica and Teflon sheets   madhav rao
• [mems-talk] Machining fused quartz/silica?   Po-Jui Chen
• [mems-talk] Wrinkles on the sidewall of SU-8 layer   郑瑞麟(Ruilin Zheng)
• [mems-talk] AFM scratch photoresist for nanograting   Jeff Kettle
• [mems-talk] Chemical Etchants for Ag   basar bolukbas
• [mems-talk] Integrating a thick dielectric layer surroundingsuspended silicon nitride membranes   Michael D Martin
• [mems-talk] Integrating a thick dielectric layer surrounding suspended silicon nitride membranes   Ken Healy
• [mems-talk] 20um features using AZP4620   Haixin Zhu
• [mems-talk] Integrating a thick dielectric layer surroundingsuspended silicon nitride membranes   Roger Shile
• [mems-talk] Wrinkles on the sidewall of SU-8 layer   Oakes Garrett
• [mems-talk] 20um features using AZP4620   李加东
• [mems-talk] Selective etching between Cu and Ni / Ag   汪飞
• [mems-talk] AFM scratch photoresist for nanograting   刘畅
• [mems-talk] Dissolving carboxylate modified micro spheres stick to the PDMS channel walls   Mohammed Asfer
• [mems-talk] Dissolving carboxylate modified micro spheres stick to the PDMS channel walls   Le Cao Hoai Nam
• [mems-talk] Chemical Etchants for Ag   Sarosh Khwaja
• [mems-talk] electroforming service   wang hong
• [mems-talk] electroforming on nickel plate   howiewang
• [mems-talk] 20um features using AZP4620   Haixin Zhu
• [mems-talk] photo-defineable liquid polyimide   Haixin Zhu
• [mems-talk] Selective etching between Cu and Ni / Ag   Gabriel Matus
• [mems-talk] Entegris/Fluoroware IC trays   Xiaoguang Liu
• [mems-talk] 20um features using AZP4620   Tolga YELBOGA
• [mems-talk] 20um features using AZP4620   Robert Black
• [mems-talk] 20um features using AZP4620   Haixin Zhu
• [mems-talk] 20um features using AZP4620   Haixin Zhu
• [mems-talk] SIMOX suppliers   Andrea Mazzolari
• [mems-talk] RIE on SOI   Jie Zou
• [mems-talk] Au electroplating on Cu seed layer   BastiWicklein at aol.com
• [mems-talk] RIE on SOI   Roger Shile
• [mems-talk] Au electroplating on Cu seed layer   shay kaplan
• [mems-talk] RIE on SOI   Jie Zou
• [mems-talk] powder blasting machine required for glass etching   ashwini jambhalikar
• [mems-talk] thickness variation of SU-8 layer   Meifang Lai
• [mems-talk] Wet Etch of Ta2O5 Thin Film   Gord Wang
• [mems-talk] Dry etching of titanium   Andreas Fischer
• [mems-talk] Dry etching of titanium   Trent Huang
• [mems-talk] thickness variation of SU-8 layer   Oakes Garrett
• [mems-talk] Gold pad bonding problem   Guillaume Bougrine
• [mems-talk] Ohmic contact on silicon with antimony contamination   Moshe
• [mems-talk] Wet release tool for MEMS   Du Bois Bert
• [mems-talk] Gold pad bonding problem   Richard B. Keithley
• [mems-talk] Adhesion b/w Ni and electroplated Cu   Sardar Bilal
• [mems-talk] 20um features using AZP4620   Brubaker Chad
• [mems-talk] 20um features using AZP4620   Haixin Zhu
• [mems-talk] Query related to oxide nitride stack deposition on a silicon wafer   Anurag Tripathi
• [mems-talk] Cr-Au layer detached after baking   Jie Zou
• [mems-talk] Re： Gold pad bonding problem   matthew king
• [mems-talk] Cr-Au layer detached after baking   Trent Huang
• [mems-talk] 20um features using AZP4620   Tolga YELBOGA
• [mems-talk] Gold pad bonding problem   Kim Anh Bui
• [mems-talk] Cr-Au layer detached after baking   Rick Williston
• [mems-talk] Cr-Au layer detached after baking   Jie Zou
• [mems-talk] 20um features using AZP4620   Oakes Garrett
• [mems-talk] MEMS dicing issue   Terry Zhu
• [mems-talk] Cr-Au layer detached after baking   Jie Zou
• [mems-talk] Ohmic contact   Moshe
• [mems-talk] Cr-Au layer detached after baking   Rick Williston
• [mems-talk] Ohmic contact   xudehui0108
• [mems-talk] thermally driven flow in microfluidic channel   Jose Guevarra
• [mems-talk] Pyrex wafers sticking together during adodic bond   Roger Shile
• [mems-talk] thermally driven flow in microfluidic channel   Kevin Paul Nichols
• [mems-talk] Cr-Au layer detached after baking   Jie Zou
• [mems-talk] Pyrex wafers sticking together during adodic bond   Shay Kaplan
• [mems-talk] Glass to Kovar anodic bonding   ashwini jambhalikar
• [mems-talk] Pyrex wafers sticking together during anodic bond   Brad Johnson
• [mems-talk] Polymer residual about RIE etching of SiO2 by CHF3   liuxf
• [mems-talk] Argon sputter recipe   Vitaley Zaretskey
• [mems-talk] protocol for octadecyltrichlorosilane (OTS)   Barbara Cortese
• [mems-talk] Polymer residual about RIE etching of SiO2 by CHF3   Kvel Bergtatt
• [mems-talk] Glass to Kovar anodic bonding   Andrea Mazzolari
• [mems-talk] Polymer residual about RIE etching of SiO2 by CHF3   Andrew Sarangan
• [mems-talk] Glass to Kovar anodic bonding   shay kaplan
• [mems-talk] low viscosity and thermal(<130C)/UV curable dielectric materail   Bong Hwan KIM
• [mems-talk] Glass to Kovar anodic bonding   Seongmu Heo
• [mems-talk] Polymer residual about RIE etching of SiO2 by CHF3   Kvel Bergtatt
• [mems-talk] A method to design and calculate the parameters of a mechanical normally-closed microvalve with electrostatic actuation   Denis Petrov
• [mems-talk] Glass to Kovar anodic bonding   Sarosh Khwaja
• [mems-talk] Glass to Kovar anodic bonding   Seongmu Heo
• [mems-talk] A method to design and calculate the parameters of amechanical normally-closed microvalve with electrostatic actuation   Albert Henning
• [mems-talk] Glass to Kovar anodic bonding   Sarosh Khwaja
• [mems-talk] thickness variation of SU-8 layer   Meifang Lai
• [mems-talk] sheathed flow control in microfluidics chip   Jose Guevarra
• [mems-talk] Polymer residual about RIE etching of SiO2 by CHF3   liuxf
• [mems-talk] keeping PDMS level   Jose Guevarra
• [mems-talk] Critical Dry   Ramakrishna Kotha
• [mems-talk] Critical Dry   Shay Kaplan
• [mems-talk] Critical Dry   Bill Moffat
• [mems-talk] Critical Dry   Yianni Tousimis
• [mems-talk] keeping PDMS level   Sarosh Khwaja
• [mems-talk] keeping PDMS level   Bill Moffat
• [mems-talk] keeping PDMS level   omondrag at ucsd.edu
• [mems-talk] keeping PDMS level   Mohd.Yusuf
• [mems-talk] Critical Dry   Kagan Topalli
• [mems-talk] BCB cure   Cassie Iany
• [mems-talk] Electroless Cu plating   Cassie Iany
• [mems-talk] BCB cure   P.E.M. Kuijpers
• [mems-talk] Electroless Cu plating   shay kaplan
• [mems-talk] Electroless Cu plating   Gord Wang
• [mems-talk] pdms removal   Jose Guevarra
• [mems-talk] pdms base/curing agent ration   Jose Guevarra
• [mems-talk] pdms removal   Mohd.Yusuf
• [mems-talk] pdms base/curing agent ration   Mohd.Yusuf
• [mems-talk] BCB cure   Cassie Iany
• [mems-talk] pdms base/curing agent ration   Barbara Cortese
• [mems-talk] BCB cure   Trent Huang

Last message date: Mon Jun 30 12:49:37 EDT 2008
Archived on: Mon Jun 30 13:30:26 EDT 2008

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