[mems-talk] apply bias at the back of silicon substrate

Chunghao (Joseph) Chen chen170 at purdue.edu
Sun Mar 2 17:38:12 EST 2008


Hongzhi,

Silver paste or silver epoxy could be the one you are looking for. 

Best,

Joseph

----- Original Message ----- 
From: "Hongzhi CHEN" <cfzsg at yahoo.com>
To: <mems-talk at memsnet.org>
Sent: Saturday, March 01, 2008 7:33 PM
Subject: [mems-talk] apply bias at the back of silicon substrate


>I have fabricated some devices on the top of the
> silicon dioxide on some heavily doped SiO2/Si wafers.
> And then I want to apply the bias to the heavily doped
> silicon through the backside of substrate, generating
> electric field to change some properties of my devices
> on the top. 
> 
> I made some PCBs which have big pad on the top. I
> contacted and pressed the back side of the silicon to
> the PCBs. However, it seems the electrical field can
> not be generated in this way, since nothing changed
> after I apply the bias the pads on the PCBs. 
> 
> I think the contact between the pads and the backside
> of the silicon maybe not good. 
> 
> Any advice will be appreciated. I heard some people
> put some epoxy at the back of the silicon to make it
> ohmic contact. Does anyone know what kind of epoxy are
> they using? And are there other ways to do it instead
> of using epoxy? Thanks a lot in advanced.
> 
> Hongzhi Chen


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