[mems-talk] looking for references; DRIE uniformity vs residual stress

[Matthew Walker]

Hi All,

Has anyone any references on DRIE etch uniformity sensitivity to 
residual stress?  Particularly the Bosch process.

I know I have heard that Si etches less uniformly if it is stressed,
kinda like stress corrosion, the bonds are easier to break if they
are stretched so higher stress is higher etch rate.

thanks,
  Matthew