[mems-talk] NIL: NXR-2010 resist gets ripped off

Jose Guevarra jose.dr.g at gmail.com
Fri Aug 28 10:22:59 EDT 2009


Hi,

  I'm doing a nanoimprint lithography process where I've been using a 
soft mold (embossed Surlyn) and NXR-2010 photoresist (25nm) with several 
underlayers namely, TI-Prime, NXR-3022, and PMMA.  I crosslink the resist 
with UV then try to remove the soft mold; the resist seems to get ripped 
off on most occasions. As far as I know, Surlyn can't be silanized which 
would prevent the resist from sticking to it.

Can anyone suggest a way of getting better adhesion between the 
underlayer and resist? or a treatment for Surlyn.

Thanks.


More information about the MEMS-talk mailing list