From pradeep.ntu at gmail.com Wed Jul 1 07:00:55 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Wed, 1 Jul 2009 14:00:55 +0300 Subject: [mems-talk] Oxidation of Molybdenum In-Reply-To: References: Message-ID: Dear Ozgur, Thanks a lot for your detailed reply. I will deposit 10 nm TiW / 300 nm Mo. Your information is really useful. Thanks, Pradeep On Tue, Jun 30, 2009 at 10:18 PM, ozgur celik wrote: > Hi > > I did not do any electroplating but I have done a lot of surface chemistry > on Mo. > > If the MoOx is the problem. > > Mo surface always has thin native oxide , as it is in most of the metals. > But when the surface is passivated with this oxide, further oxidation almost > stops. > > You can etch this oxide in various ways but as soon as you bring the Mo in > air it will re oxidize, a thin layer like 1-2 nm thick, > > Someone did suggest a website: > > http://www.ee.byu.edu/cleanroom/wet_etch.phtml > > The suggested method in this web site is HCl+H2O2. In this method H2O2 > oxidizes Mo and acid dissolves it, as a result Mo gets etched. However this > will never remove the oxide, final surface will allways have oxide due to > H2O2. Also it is an isotropic and very fast etchant. Depending on how thick > Mo is but you can loose all Mo in seconds. You can try acid only. > > Also You can use dry etching like, fluorine or chlorine chemistry would > etch it but you need to find a way to transfer it to your electroplating > apparatus without bringing it to air. > > cheers > > ozgur From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW/ 300 nm Cu. features are circular vias and have relatively large variation in diameter. 20 um vias are besides 100 um vias and 500 um vias. Electroplating type: DC, 5 mA/cm2 current density I want to know in advance: will the electroplated thickness be same for all feautures (20 um, 100 um, and 500 um) ? OR 500 um diamter vias will be plated faster . Your opinion will be appreciated. Thanks, Pradeep From pradeep.ntu at gmail.com Fri Jul 3 05:24:39 2009 From: pradeep.ntu at gmail.com (Pradeep Dixit) Date: Fri, 3 Jul 2009 12:24:39 +0300 Subject: [mems-talk] Metal electrodeposition rate Message-ID: Hello All, I would like to check some thing with you. During through-resist electroplating, does metal deposition rate depend upon the opening dimension of features? I am trying to electroplating 8 um thick copper structures. resist mold is 12 um thick AZ9260. Seed layer is 30 nm TiW