Dear Hongjun,

Check out http://www.evgroup.com/products/tempbonder.htm

For temporary bonding your substrate to a carrier and release after the process
is done. On the Web site you will find papers and application notes on temporary
bonding and debonding as well.

Best regards,
Helge

-----Original Message-----
From: Hongjun Zeng [mailto:hzeng@ece.uic.edu]
Sent: Thursday, May 01, 2003 4:17 PM
To: MEMS2
Subject: [mems-talk] How to handle ultra thin wafer


Dear colleagues,

I'm going to use some ultra thin silicon wafers (10-20um). I found meet a
basic problem----how can I handle them without making it broken. Any
suggestion would be appreciated.

Hongjun Zeng
**********************************************
Microfabrication Applications Laboratory (MAL)
University of Illinois at Chicago
ERF Building, 842 W. Taylor Street
Chicago, IL 60607-7022
Tel.: 312-413-5889, Fax: 312-996-6465
**********************************************



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