Hi, David,

I am not using CMOS backend Damascene process for some limitation.

What I need is some good etchant of good selectivity for Cu over other
materials can be taken as Hard Mask(i.e. PhotoResist), most importantly,
of good functionality to give a good sidewall,(NO sideway etching) which
gives anisotropic etching.

Johnny
===========================================
Johnny H.HE,  Ph.D. Candidate
Division of Electrical Engineering, Engineering
Department,Cambridge University,CB2 1PZ, UK
or Downing College, Cambridge, CB2 1DQ ,UK
Email: jh353@cam.ac.uk
Tel:+44 1223 765199 Fax:+44 1223 332662
===========================================


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Message: 1
Date: Fri, 2 May 2003 10:38:33 -0400
From: "David Nemeth" 
Subject: RE: [mems-talk] Anisotropic Cu Wet etching
To: "General MEMS discussion" 
Message-ID: 
Content-Type: text/plain;       charset="us-ascii"

I don't have experience with this personally, but my understanding is
that CMOS processing of copper is done by forming grooves,
electroplating the copper, and polishing back to the tops of the
grooves.  I don't know that a good anistropic etch exists for copper.

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
Ph: (703) 961-9573 x206
Fax:(703) 961-9576