Try a lower temperature epoxy.  The wafers don't see a temp greater than 115C
after the metal process.

Mike

-----Original Message-----
From: weiwei2 [mailto:weiwei2@pd.jaring.my]
Sent: Monday, May 05, 2003 12:25 PM
To: General MEMS discussion
Subject: [mems-talk] thermal effect on MUMPS


i did die attach of MUMPS die onto PCB using thermal cure epoxy at 150C. it
cause extra curling of MUMPS cantilever. how to solve this? is there any
literature on this?

LEOW
Universiti Teknologi Malaysia


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