Hi Chenyan,

I had used EN process as a Under Bump Metallization for wafer bumps. What is
your application and what thickness are you expecting.
Regards Gautham Viswanadam; Managing Director, Absara Micro Systems (S) Pte
Ltd; 17, Philips Street, #05 - 01; Grand Building
Singapore - 048695. Ph: 65 64841430 Fax: 65 64842780; e-mail:
absara@singnet.com.sg


----- Original Message -----
From: "Chen Yan" 
To: 
Sent: Monday, May 05, 2003 5:22 PM
Subject: [mems-talk] electro and electroless plating for Ni?


> Hi there,
>
> Any infomation about electro and electroless plating for Ni?
>
> Thank you for any help!
>
> chenyan
>
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