Another way to get a vertical sidewall would be to use an isotropic etchant
(e.g. FeCl), and undercut your mask pattern.  You'd have to compensate the
mask pattern to get the right linewidth.  If you undercut enough, the
sidewalls should approach vertical.

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org]On Behalf Of BobHendu@aol.com
Sent: Tuesday, May 06, 2003 11:08 AM
To: General MEMS discussion
Subject: Re: [mems-talk] RE: Anisotropic Cu Wet etching


The only way I know of for you to produce the desired sidewall profile is to
do a photo lift-off process. You can contact Bill Moffet at Yield
Engineering Service who contributes to this forum a lot. He is an expert in
this area. They are located in Bay area California. Bob Henderson

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