Hi Gautham,
Thank you for help!
I am using it for a microswitch, deposit a thick layer 2um on top of 2000A Au
for a beam. So
what is the EN process?

Regards,
chenyan

Hi Chenyan,

I had used EN process as a Under Bump Metallization for wafer bumps. What is
your application and what thickness are you expecting.
Regards Gautham Viswanadam; Managing Director, Absara Micro Systems (S) Pte
Ltd; 17, Philips Street, #05 - 01; Grand Building
Singapore - 048695. Ph: 65 64841430 Fax: 65 64842780; e-mail:
  absara at
singnet.com.sg