Dear Abhinav,

Photodefinable or not, most polyimides of HDMicrosystems should easily
satisfy 2, 3 and 4. (I guess 1 also)

O2 Plasma before depositing metals onto polyimide should help adhesion.
Once hardbaked, PI can withstand 175C, UV, developer and acetone.  The cure
temp is >300C usually !

PIX series should be OK.  HDMicrosystems will help you more in detail.  They
provide good technical assistance.

Good luck,

Oray Orkun Cellek
Research Assistant, Ph. D. Student
Electrical & Electronics Engineering Department
Middle East Technical University
06531 Ankara
Turkey
Tel : +90 312 210 4579
Fax : +90 312 210 1261
e-mail : o.o.cellek@ieee.org

----- Original Message -----
From: "Abhinav Bhushan" 
To: "General MEMS discussion" 
Sent: Tuesday, June 10, 2003 10:06 PM
Subject: [mems-talk] Polyimide layer as substrate layer


> Hi,
>
> I am wondering if anyone can suggest a polyimide for
> my application. I want to coat a nickel substrate with
> a polyimide film (preferably by spin coating). Then I
> want to process pr on the polyimide, deposit metal and
> do lift off, all the while keeping the polyimide layer
> unchanged. The film should have:
>
> 1. Good adhesion to the substrate (nickel),
> 2. Should survive lift-off of thin positive pr
> (acetone),
> 3. Should provide good adhesion to Cr-Au or TiW-Au
> layer,
> 4. And it would be nice if the polyimide can withstand
> a temperature of at least 175 C.
>
> I have heard of photodefinable polymides by HD
> microsystem, and the PI2610 series, but I think they
> are used for patterning the polymide itself. I want to
> use the polyimide as an underlying layer, so it should
> not be attacked by UV light, pr developer and acetone.
>
>
> I would appreicate any help,
>
> Abhinav
> CAMD, LSU
>
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