I'm Jong-Woo Shin, and a graduate student in electrical engineering at
Seoul Nat'l Univ., Korea.

I work for a mems research center(Micro system Technology Center, MicroTeC)=
 in
Seoul Nat'l Univ. as a RA.

In the MicroTeC, we are going to purchase an ashing equipment for
sacrificial polymer(thick PR, polyimide...) removal.

The structural layer will be metal(such as aluminum, nickel, gold), so it=
 must
have selectivity with metal. And because it has to etch(undercut) the=
 polymer layer
under metal structural layer(maximum 300 micrometers), it must etch=
 isotropically.
And we also need to control the substrate temperature to prevent=
 deformation
of structural layer.

I want some advices about an asher from you. What kind of asher you use to
undercut sacrificial polymer layer.

Thank you.

Jong-Woo Shin
email: hinge@plaza.snu.ac.kr
fax: +82-2-873-9953
tel: +82-2-886-6976