Try TWI ( the welding institute in London)also try searching for "mallory bond"
and Field assist bonding ref sensors and materials, 3 (1988) 143-151, key words
field -assisted bonding,FAB, interfacial
strength,fracture limit, micromechanics
-----Original Message-----
From: mems greenhorn [mailto:mems_greenhorn@yahoo.com]
Sent: Tuesday, June 17, 2003 7:34 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Anodic Bonding


Can anyone let me know where I can find a good paper on Anodic Bonding..Trying
to do the anodic bonding at device level
for the first time..so need info on the procedure involved ...
- Are there any restrictions on the type of  Oxidation ( Thermal or PECVD)  that
Si wafer should have..
- What wafer thickness and oxide thickness would be ideal. ?
- What voltage and temperatures ?
- Significance of the mechanical pressure...?
- Is vaccum a must ?
Any other info that u can give to get a good bonding would be of great help !
Thanks in advance.
MEMS_GREENHORN


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