Plan Optik GmbH in Germany produces glass (e.g. Pyrex) wafers with holes. The wafers can be from 100 microns (thickness) up to 5000 microns. The wafer size can be from 1" to 12". The minimum hole diameter is approximately 500 microns (there is no maximum hole diameter). For that a newly developped, numerically controlled, ultrasonic drilling process (so called USHD) is used. More information can be found at http://www.planoptik.com/page-engl/77.html Carsten Wesselkamp Plan Optik GmbH mailto:c.wesselkamp@planoptik.com -----Original Message----- From: Bill Flounders [mailto:bill@eecs.berkeley.edu] Sent: Monday, July 07, 2003 6:03 PM To: General MEMS discussion Subject: Re: [mems-talk] Making holes in Pyrex glass wafers? Alternate Ultrasonic Machining Contact: Perhaps related? J.A. Anderson Associates Precision Glass/Ceramics and Ultrasonic Machining 630-377-6565 john@jaanderson.com www.jaanderson.com Bill Flounders, Ph.D. Technology Manager Berkeley Microlab Kirt & Erika Zipf-Williams wrote: >>Hi, We are looking for supplier who can drill more than 1 mm holes on > > thick > >>(1 mm) Pyrex glass wafers. Please write to propak@singnet.com.sg Regards. > > > Check with Sensor Prep Services in Illinois at 630-365-9645. > They do ultrasonic drilling through even thicker glass. > > --Kirt Williams, Ph.D. consultant > > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/