Dear All,

I tried to plate Gold over a Platinum thin film (3000 Angstrom) on SiO2.
Before the plating, we go through a degreasing step, wherein we boil the
Silicon wafers in Tri Chloro Ethylene, followed by a dilute HCl dip.
The Pt film is deposited by DC sputtering.

The trouble is that the Pt film peels off when the HCl dip is done.

What should I do to overcome this problem?

Thanks in advance.

Thanking You,
With Best Regards,
Sriram
Senior Process Engineer,
BEL Bangalore
INDIA